Importance

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Abstract

A developing treatment apparatus has a spin chuck for supporting a semiconductor wafer on which a photoresist to be developed is formed by suction and rotating it at least two rotating speeds including a low speed and a high speed, a washing liquid supplying nozzle for supplying pure water onto the surface the photoresist, and a developer supplying nozzle for supplying a developer on the same surface. While the semiconductor wafer is supported on the spin chuck by suction and rotated at a low speed, pure water is supplied from the tip of the washing liquid supplying nozzle. Rotating the spin chuck is stopped and supplying the pure water is stopped to form a pure water film having a thickness of several mm on the surface of the photoresist by surface tension, after which for several seconds a developer is sprayed in a mist form from the tip of the developer supplying nozzle and simultaneously the spin chuck is rotated at a high speed to scatter off the pure water on the photoresist gradually, thereby replacing the pure water film on the photoresist with the developer. Subsequently, the spin chuck is rotated at a low speed while the developer is sprayed in a mist form on the surface of the photoresist, thereby stretching and straining the developer, in a liquid form, on the surface of the photoresist and developing the photoresist.

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First Claim