Methods of making microelectronic assemblies
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United States of America Patent
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Mar 23, 1999
Issued Date -
N/A
app pub date -
Feb 6, 1998
filing date -
Mar 28, 1995
priority date (Note) -
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Abstract
A method of making a microelectronic assembly includes providing a starting subassembly having a microelectronic component with a top surface and having electrical contacts, the subassembly further including a plurality of terminals over the top surface of the component, each terminal being connected to at least one contact of the component but moveable with respect to the component; positioning a plurality of joining units each having a solid core on the terminal; providing a unit bonding material at interfaces between each core terminal; and bonding the joining units to the terminals by heating the joining units and terminals so as to convert the unit bonding material to a liquid phase without melting the cores and solidifying the unit bonding material.
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