Lead frame and integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 1999
Grant Date -
N/A
app pub date -
Sep 18, 1996
filing date -
Sep 20, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame includes a plurality of leads held by an insulative holding film and each formed of an inner lead portion for being bonded to a semiconductor chip and an outer lead portion, a pad portion formed at an end portion of the outer lead portion, an insulating film formed in a pattern so as to insulate the adjacent leads, a ground film formed on the pad portion and partially on the insulating film and having a wider area as compared with that of the pad portion, and a projecting electrode formed on the ground film.
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