Semiconductor device package having inner leads with slots
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 1999
Grant Date -
N/A
app pub date -
Aug 6, 1997
filing date -
Oct 4, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device package includes a semiconductor chip and a plurality of inner leads, each having at least one slot formed along an upper surface of the inner lead. An adhesive layer is used to attach a bottom surface of the semiconductor chip to the upper surface of the inner lead. An encapsulant is allowed to flow in a package body mold, around the inner leads and through the slot. The slots prevent the production of turbulence along a side surface of the inner lead opposite to the flow direction, thereby avoiding problems associated with incomplete encapsulation such as the internal voids.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully