Angularly offset and recessed stacked die multichip device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 23, 1999
Issued Date -
N/A
app pub date -
Oct 3, 1997
filing date -
Aug 16, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An offset die stacking arrangement is disclosed having at least one upper level die having a width which is less than the distance separating the opposing bonding sites of the underlying die. The lowest die is affixed to the substrate within a recess in the substrate. The upper die is fixed above the lower die and rotated within a plane parallel to the lower die through an angle which insures that none of the bonding sites of the lower die are obstructed by the upper die. Once the dice are fixed in this manner, the entire assembly is subjected to the wire bonding process with all of the bonds being made in the same step.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully