High performance epoxy based laminating adhesive
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United States of America Patent
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Mar 30, 1999
Issued Date -
N/A
app pub date -
Oct 3, 1997
filing date -
Feb 8, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for producing an improved three-dimensional polymeric adhesive material comprises: (1) reacting a starting polymer containing an active hydrogen or hydroxy function with a polyfunctional nucleophile to form an adduct product; and (2) reacting the adduct product with a polyelectrophile to generate a three-dimensional polymeric adhesive material. Preferably, the starting polymer is a high molecular weight polyester, the polyfunctional nucleophile is a polyisocyanate, and the polyelectrophile is at least one polyepoxide. The present invention also encompasses processes for bonding at least two substrates by generating the adhesive material between them, as well as the adhesive material itself. The invention is particularly suitable for bonding electronic components such as printed circuit boards.
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Cited Art Landscape
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