Curable resin composition
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United States of America Patent
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Mar 30, 1999
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N/A
app pub date -
Mar 4, 1997
filing date -
Mar 4, 1996
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Abstract
A curable resin composition containing (a) an oxyalkylene polymer which comprises at least one silicon-containing group having at least one hydroxyl or hydrolyzable group bonded to a silicon atom, (b) an epoxy resin, (c) a ketimine compound and (d) a carbonyl compound, which has improved storage stability.
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