Media compatible microsensor structure and methods of manufacturing and using the same
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United States of America Patent
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Mar 30, 1999
Grant Date -
N/A
app pub date -
Apr 3, 1995
filing date -
Apr 3, 1995
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A media compatible microsensor structure (11) for sensing an environmental condition in a harsh media includes an inorganic protective film (17) covering portions of the structure that will be exposed to the harsh media. In one embodiment, the microsensor structure (11) includes a microsensor package (12), a microsensor device (16) bonded to the microsensor package (12), a leadframe (13), a connective wire (14) connecting the microsensor device (16) to the leadframe (13), and an inorganic protective film (17) formed on all or portion of the exposed surfaces of the structure.
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