Multilayer wiring structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5889233
SERIAL NO

08696645

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A multilayer wiring structure having a flame-retardant property corresponding to the V-0 class in the UL 94 standard is provided without degrading the inherent properties of a benzocyclobutene resin. The multilayer wiring structure contains a lower-level wiring layer formed on a base material, a lower-level interlayer insulating layer formed to cover the lower-level wiring layer, and an upper-level wiring layer formed on the interlayer insulating layer, an upper-level interlayer insulating layer formed to cover the upper-level wiring layer, and a protection layer formed to cover the upper-level interlayer insulating layer. Each of the lower- and upper-level interlayer insulating layers is made of a benzocyclobutene resin. The protection layer has a flame-retardant or non-flammable property corresponding to the V-0 class in the UL 94 standard. The protection layer may be made of a flame-retardant material such as a fluororesin, a polyimide resin or an epoxy resin. The protection layer may be made of a non-flammable material such as silicon dioxide or silicon nitride.

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Patent Owner(s)

  • NEC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsui, Koji Tokyo, JP 61 980
Shimoto, Tadanori Tokyo, JP 33 862

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