Structure for bonding semiconductor device to substrate
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United States of America Patent
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Mar 30, 1999
Issued Date -
N/A
app pub date -
Feb 27, 1997
filing date -
Feb 27, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
Au bump is provided on an Al pad of a semiconductor chip. Substrate pads are arranged at predetermined pitches on a circuit board. In each substrate pad, the length (L) of a first side parallel to the array direction is shorter than the length (M) of a second side which is orthogonal to the first side. The substrate pads are formed so that the length (L) of the first side is smaller than the diameter of the Au bump and the length (M) of the second side is larger than the diameter of the Au bump. A solder bump is formed on each substrate pad and it melts to cover the Au bump. At the time of bonding, the width of the solder bump in the direction parallel to the first side is smaller than the diameter of the Au bump, and the width thereof in the direction parallel to the second side is greater than the diameter of the Au bump.
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