Electrical connection for slider/suspension assembly
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United States of America Patent
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-
Mar 30, 1999
Grant Date -
N/A
app pub date -
Jun 12, 1997
filing date -
Jun 12, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Disclosed are an electrical connection assembly for a data storage device and a method of fabricating the electrical connection between a transducer termination pad formed on a slider and a suspension having a conductive lead structure. A compliant cantilevered conductive pad is formed at the end of the conductive lead structure. A solder bump is formed on the transducer termination pad, and may be formed subsequent to dicing the sliders. The slider is placed in mechanical contact with the suspension for mechanical support such that the solder bump contacts the cantilevered conductive pad, which cantilevered conductive pad complies with the solder bump to absorb positional errors. Then, the solder bump is heated, preferably by a laser, so as to reflow the solder bump to make an approximately right angle solder fillet joint electrical connection with the cantilevered conductive pad.
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