Importance

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Abstract

An apparatus for mounting electrically conductive balls includes a mounting head which has an attracting tool with a number of attracting holes in its lower surface and attracts electrically conductive balls through a vacuum. The attracting tool is resiliently supported by the mounting head through springs. A flux is stored in a container at a predetermined depth. The electrically conductive balls attracted to the attracting tool project from its lower surface by a length larger than the depth of the flux. When the attracting tool is lowered, the electrically conductive balls contact a bottom surface of the container in a resilient manner due to spring tension of the springs. Then, by raising the attracting tool, the flux adheres to lower surfaces of the electrically conductive balls. With the flux kept at a proper depth, it can be made adhere in appropriate amount to all the electrically conductive balls at one time. It is thus possible to adhere a flux or adhesive in an appropriate amount to a number of electrically conductive balls with high working efficiency and improve productivity of workpieces with bumps considerably.

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First Claim