Electrical and thermal conducting structure with resilient conducting paths
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United States of America Patent
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Apr 6, 1999
Grant Date -
N/A
app pub date -
May 17, 1996
filing date -
May 17, 1996
priority date (Note) -
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Abstract
A conducting structure includes a dielectric matrix with a first surface and a second surface. At least one via extends from the first surface of the matrix to the second surface of the matrix. In the at least one via conductive members are formed which include conductive elements and an optional binder. The conductive elements have a maximum dimension of: (i) at least about 5% of a length of the via, and, (ii) at least about 10% of the width of the via. The size, shape and number of conductive elements in each via, as well as the composition of the binder, may be selected to provide a conductive element with a controlled electrical and/or thermal conductivity, and a controlled modulus, for a particular application.
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