Printed circuit board process using plasma spraying of conductive metal
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United States of America Patent
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-
Apr 6, 1999
Issued Date -
N/A
app pub date -
Oct 2, 1996
filing date -
Sep 15, 1995
priority date (Note) -
Expired
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Abstract
A printed circuit board is formed by preparing at least one surface of a substrate with a pattern including selected areas for receiving metal, and non-selected areas to which metal will not adhere; the surface is then plasma sprayed with metal to coat the selected areas.
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