Test and tear-away bond pad design
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United States of America Patent
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Apr 6, 1999
Issued Date -
N/A
app pub date -
Oct 7, 1997
filing date -
Oct 28, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process of providing a bond pad arrangement for use with a thermocompression wire bonder including a primary bond pad for connection of an integrated circuit during a production assembly process, and a secondary test bond pad contiguous with the primary bond pad for connection of a wire to the integrated circuit. Including performing a test sequence, and removing the wire from the secondary test bond pad.
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