Heating and cooling apparatus for reaction chamber
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United States of America Patent
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-
Apr 6, 1999
Grant Date -
N/A
app pub date -
Nov 27, 1996
filing date -
Dec 1, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a temperature regulation apparatus capable of easily regulating the temperature of a support for a substance to be treated, such as a semiconductor wafer. The temperature regulation apparatus includes a liquid nitrogen supply device for supplying liquid nitrogen into a temperature regulation space provided in the inside of a support so as to effect flashing of the liquid nitrogen. A heating device for heating the support and temperature sensors for detecting the temperature of the support are also provided. A temperature setting device sets the temperature of the support at a desired temperature and a controller controls the liquid nitrogen supply device and the heating device based on a temperature detected by the temperature sensors, so that the support reaches and is maintained at the set temperature.
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