Integrated silicon vacuum micropackage for infrared devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 20, 1999
Issued Date -
N/A
app pub date -
Sep 29, 1997
filing date -
Dec 13, 1993
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An efficient method brings together two wafers of dies that contain an infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasonic bonding can be used.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully