Process for making integrated circuit structure comprising local area interconnects formed over semiconductor substrate by selective deposition on seed layer in patterned trench
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 20, 1999
Issued Date -
N/A
app pub date -
Jun 12, 1997
filing date -
Nov 9, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A local area interconnect structure comprising one or more electrically conductive interconnects formed from electrically conductive metal compounds is described and a process for forming same. Electrically conductive metal compounds are selectively deposited in one or more trenches which were previously formed in an insulation layer in a configuration conforming to the desired pattern of the electrically conductive interconnects. A seed layer is first selectively formed on surfaces of the trenches and the electrically conductive metal compound is then selectively deposited over the seed layer in the trench, but not on the exposed surfaces of the insulation layer.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully