Process for encapsulating an electronic component
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United States of America Patent
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Apr 20, 1999
Grant Date -
N/A
app pub date -
Dec 29, 1995
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of: placing the component to be encapsulated in a cavity of a mold; introducing the encapsulating material at elevated temperature into the cavity between the mold and the component to be encapsulated; hardening the encapsulating material; and releasing the encapsulated component from the cavity, the encapsulating material used comprising 40-65% by weight of the engineering thermoplast and 60-35% by weight of the reactive solvent.
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