Bond pads for metal welding of flexure to air bearing slider and grounding configuration thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 20, 1999
Grant Date -
N/A
app pub date -
Sep 5, 1997
filing date -
Sep 5, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A magnetic head assembly has a plurality of slider electrical bond pads arranged in a first configuration on a top surface opposite the air bearing surface of a slider. A plurality of slider mechanical bond pads are arranged in a second configuration on the top surface of the slider. A plurality of flexure electrical bond pads are arranged in a third configuration on a bottom surface of a flexure. The third configuration and the first configuration are such that the slider electrical bond pads mate with the flexure electrical bond pads. A plurality of flexure mechanical bond pads are arranged in a fourth configuration on the bottom surface of the flexure. The fourth configuration and the second configuration are such that the slider mechanical bond pads mate with the flexure mechanical bond pads. Slider-to-flexure weld joints join the flexure electrical bond pads to the slider electrical bond pads. Slider-to-wire weld joints join the flexure mechanical bond pads to the slider mechanical bond pads.
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