Method for manufacturing electrically conductive lead-throughs in metallized plastic housings
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United States of America Patent
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Apr 27, 1999
Grant Date -
N/A
app pub date -
Apr 3, 1997
filing date -
Apr 13, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.
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