Apparatus and method for housing high heat emission electro-optical components
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United States of America Patent
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Apr 27, 1999
Grant Date -
N/A
app pub date -
Mar 24, 1997
filing date -
Apr 5, 1996
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An optoelectronic apparatus includes a casing and an optical unit (300) on which at least one component (300) having high heat emission is disposed. This component is initially linked with clearance with the optical unit, by first fastening means, and in a second step by second fastening means the component is fixedly secured to the casing in a thermal contact state.
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