Composition for forming high thermal conductivity polybenzoxazine-based material and method
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United States of America Patent
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May 4, 1999
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N/A
app pub date -
May 1, 1997
filing date -
May 1, 1997
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Abstract
The present invention relates to a composition and method for forming a high thermal conductivity polybenzoxazine-based material. The composition comprises at least one benzoxazine resin and a filler material which includes particles of boron nitride in an amount sufficient to establish a thermal conductivity of between about 3 W/mK and 37 W/mK in the polybenzoxazine-based material.
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