Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same

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United States of America Patent

PATENT NO 5900673
SERIAL NO

08704803

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Abstract

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A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.

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Patent Owner(s)

Patent OwnerAddress
KYOCERA CORPORATIONFUSHIMI-KU KYOTO-SHI KYOTO 612-8501
TOKURIKI HONTEN CO LTD2-9-12 KAJI-CHO CHIYODA-KU TOKYO 1018548 ?1018548

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nishi, Koji Kokubu, JP 84 715
Watanabe, Osamu Tokyo, JP 350 4382

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