Flexible integrated circuit package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 4, 1999
Grant Date -
N/A
app pub date -
Dec 2, 1997
filing date -
Dec 2, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A flexible integrated circuit package for mounting on a substrate is disclosed. The package consists of a tape film having layers of dielectric and conductive material, a semiconductor die and an array of conductive leads. A molded body covers the die, and absorbs the majority of the pressure applied when compressing the package between a heatsink and a printed circuit board (PCB). Rigid removable support material surrounds the molded body to keep the package flat while it is being mounted to the PCB. The support material is removed after soldering of the package to the PCB. The invention permits the package to be tightly compressed between a heatsink and a substrate without causing degradation of the conductive connections. Reliability of the connections is further increased since the tape film is flexible enough to accommodate bending of the substrate to which the package is connected.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully