Mini-module with upwardly directed leads
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United States of America Patent
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-
May 4, 1999
Grant Date -
N/A
app pub date -
Jul 10, 1997
filing date -
Jul 10, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A power module with leads extending upwardly. The circuit components and connections of the power module are arranged upon a substrate having interface leads attached thereto extending away from the undersurface of the substrate. The interface leads extend through openings in a form fitting molded case. The case has an open center region to facilitate performance of final assembly steps upon the module and is subsequently covered with a rugged lid and is encapsulated with a suitable potting material. The interior of the module is filled with a gel to provide moisture-proof protection.
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