Wired base plate and package for electronic parts
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United States of America Patent
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-
May 4, 1999
Grant Date -
N/A
app pub date -
Aug 21, 1997
filing date -
Aug 21, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a wired base plate for an electronic part, an infinite number of metallic posts made of copper are provided to a lid joining section of a plural wire layer portion, which section includes a lid joining surface area to which a lid is joined. The metallic posts supports a pressure applied thereto from a lid at the time of mounting of the wired base plate on a circuit board and prevent the plural wire layer portion having a plurality of conductor wire layers and a plurality of resinous insulation layers, from being deformed by compression. A package for an electronic part having such a wired base plate is also provided.
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