Polishing machine with efficient polishing and dressing

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United States of America Patent

PATENT NO 5902173
SERIAL NO

08820484

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A dresser for dressing a polishing cloth adhered to a platen is provided with different dressing tools such as a lapping tool and a brush disposed around the lapping tool. In polishing, the platen is rotated and a wafer holding unit sucks and holds a wafer to press it against the polishing cloth while the wafer is rotated. In this manner, while polishing is performed, dressing is performed at the same time by pressing the dressing tools of the dresser against the polishing cloth. The brush and lapping tool may be rotated independently, or the dresser may be swung while it is rotated.

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Patent Owner(s)

Patent OwnerAddress
YAMAHA CORPORATION A CORP OF JAPAN10-1 NAKAZAWA-CHO HAMAMATSU-SHI SHIZUOKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tanaka, Katsunori Hamamatsu, JP 182 2493

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