Method and apparatus for improved coating of a semiconductor wafer
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United States of America Patent
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May 11, 1999
Issued Date -
N/A
app pub date -
Oct 10, 1997
filing date -
Jul 27, 1995
priority date (Note) -
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Abstract
A method and apparatus for coating liquid films on to the surface of a wafer substrate by rotation the substrate at a speed sufficient to cause a liquid, through centrifugal effect, to flow outwardly toward the perimeter of the surface and form a substantially uniform thickness liquid coating thereon and starting at the central region of the wafer surface and moving radially outward therefrom, spraying a fine mist of the liquid to the surface of the wafer.
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