Semiconductor package having capacitive extension spokes and method for making the same
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United States of America Patent
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May 11, 1999
Grant Date -
N/A
app pub date -
Apr 30, 1998
filing date -
Apr 30, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.
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