Semiconductor package having capacitive extension spokes and method for making the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5903050
SERIAL NO

09070671

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.SINGAPORE, SG22606

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Wheling Palo Alto, CA 5 231
Kirkman, Scott L Redwood, CA 3 217
Thurairajaratnam, Aritharan Fremont, CA 28 269

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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ANALOG DEVICES, INC. (1)
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AMKOR ELECTRONICS, INC. (1)
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

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