US Patent No: 5,903,050

Number of patents in Portfolio can not be more than 2000

Semiconductor package having capacitive extension spokes and method for making the same

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Importance

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Abstract

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Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.

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First Claim

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all claims..

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Patent Owner(s)

Patent OwnerAddressTotal Patents
LSI LOGIC CORPORATIONMILPITAS, CA3517

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Wheling Palo Alto, CA 7 161
Kirkman, Scott L Redwood, CA 3 199
Thurairajaratnam, Aritharan San Jose, CA 41 234

Cited Art Landscape

Patent Info (Count) # Cites Year
 
AMKOR ELECTRONICS, INC. (1)
* 5,672,909 Interdigitated wirebond programmable fixed voltage planes 18 1996
 
ANALOG DEVICES, INC. (1)
* 5,519,576 Thermally enhanced leadframe 13 1995
 
LSI LOGIC CORPORATION (1)
* 5,691,568 Wire bondable package design with maxium electrical performance and minimum number of layers 46 1996
* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (89)
7,102,208 Leadframe and semiconductor package with improved solder joint strength 3 2000
* 6,627,977 Semiconductor package including isolated ring structure 40 2002
6,818,973 Exposed lead QFP package fabricated through the use of a partial saw process 93 2002
6,919,620 Compact flash memory card with clamshell leadframe 1 2002
6,798,047 Pre-molded leadframe 7 2002
6,777,789 Mounting for a package containing a chip 9 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 16 2003
6,927,483 Semiconductor package exhibiting efficient lead placement 33 2003
6,794,740 Leadframe package for semiconductor devices 11 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 7 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 115 2003
7,008,825 Leadframe strip having enhanced testability 37 2003
6,876,068 Semiconductor package with increased number of input and output pins 58 2003
7,183,630 Lead frame with plated end leads 26 2003
6,897,550 Fully-molded leadframe stand-off feature 4 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,041 Power semiconductor package with strap 19 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 2 2003
7,245,007 Exposed lead interposer leadframe package 58 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 6 2003
6,921,967 Reinforced die pad support structure 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 8 2003
6,846,704 Semiconductor package and method for manufacturing the same 14 2003
6,967,395 Mounting for a package containing a chip 15 2003
6,893,900 Method of making an integrated circuit package 3 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 6 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 11 2003
7,115,445 Semiconductor package having reduced thickness 2 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 8 2004
7,170,150 Lead frame for semiconductor package 4 2004
6,844,615 Leadframe package for semiconductor devices 16 2004
7,005,326 Method of making an integrated circuit package 7 2004
7,190,062 Embedded leadframe semiconductor package 34 2004
7,067,908 Semiconductor package having improved adhesiveness and ground bonding 5 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 60 2004
7,202,554 Semiconductor package and its manufacturing method 17 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 19 2004
7,217,991 Fan-in leadframe semiconductor package 12 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 55 2004
7,001,799 Method of making a leadframe for semiconductor devices 7 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 4 2004
7,176,062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7,214,326 Increased capacity leadframe and semiconductor package using the same 5 2005
7,247,523 Two-sided wafer escape package 25 2005
6,995,459 Semiconductor package with increased number of input and output pins 67 2005
7,192,807 Wafer level package and fabrication method 32 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 8 2005
7,507,603 Etch singulated semiconductor package 11 2005
7,361,533 Stacked embedded leadframe 34 2005
7,572,681 Embedded electronic component package 35 2005
7,112,474 Method of making an integrated circuit package 2 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 2 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 2 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 48 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 6 2006
7,321,162 Semiconductor package having reduced thickness 2 2006
7,332,375 Method of making an integrated circuit package 2 2006
7,521,294 Lead frame for semiconductor package 6 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 32 2006
7,420,272 Two-sided wafer escape package 26 2007
7,723,210 Direct-write wafer level chip scale package 14 2007
7,692,286 Two-sided fan-out wafer escape package 31 2008
* 7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,977,163 Embedded electronic component package fabrication method 8 2009
8,796,561 Fan out build up substrate stackable package and method 0 2009
8,188,584 Direct-write wafer level chip scale package 10 2010
7,932,595 Electronic component package comprising fan-out traces 11 2010
8,324,511 Through via nub reveal method and structure 2 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,440,554 Through via connected backside embedded circuit features structure and method 1 2010
8,487,445 Semiconductor device having through electrodes protruding from dielectric layer 0 2010
8,791,501 Integrated passive device structure and method 0 2010
8,390,130 Through via recessed reveal structure and method 2 2011
8,119,455 Wafer level package fabrication method 5 2011
8,552,548 Conductive pad on protruding through electrode semiconductor device 0 2011
8,298,866 Wafer level package and fabrication method 3 2012
8,501,543 Direct-write wafer level chip scale package 1 2012
8,486,764 Wafer level package and fabrication method 1 2012
8,853,836 Integrated circuit package and method of making the same 0 2012
8,691,632 Wafer level package and fabrication method 0 2013
8,900,995 Semiconductor device and manufacturing method thereof 0 2013
8,710,649 Wafer level package and fabrication method 0 2013
 
MICRON TECHNOLOGY, INC. (8)
* 6,144,089 Inner-digitized bond fingers on bus bars of semiconductor device package 6 1997
6,249,047 Ball array layout 62 1999
6,376,282 Inner-digitized bond fingers on bus bars of semiconductor device package 3 2000
6,423,624 Ball array layout 1 2000
6,548,757 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies 44 2000
6,448,640 Ball array layout in chip assembly 18 2001
6,630,732 Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same 2 2002
6,784,367 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies 0 2003
 
ROUND ROCK RESEARCH, LLC (7)
* 6,542,720 Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices 33 1999
6,718,163 Methods of operating microelectronic devices, and methods of providing microelectronic devices 27 2003
7,107,019 Methods of operating microelectronic devices, and methods of providing microelectronic devices 15 2004
7,593,708 Methods of operating electronic devices, and methods of providing electronic devices 12 2006
7,778,621 Methods of operating electronic devices, and methods of providing electronic devices 10 2007
8,036,629 Methods of operating electronic devices, and methods of providing electronic devices 8 2010
8,554,166 Methods of operating electronic devices, and methods of providing electronic devices 0 2011
 
INTEL CORPORATION (4)
* 6,222,246 Flip-chip having an on-chip decoupling capacitor 45 1999
* 6,707,145 Efficient multiple power and ground distribution of SMT IC packages 6 2000
* 6,920,051 Hybrid capacitor, circuit, and system 25 2002
* 6,822,526 Voltage plane with high impedance link 3 2002
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (3)
* 6,429,536 Semiconductor device 22 2000
* 6,448,639 Substrate having specific pad distribution 25 2000
6,833,611 Semiconductor device 2 2003
 
CTS CORPORATION (3)
6,326,677 Ball grid array resistor network 17 1998
7,180,186 Ball grid array package 0 2003
6,946,733 Ball grid array package having testing capability after mounting 4 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,437,385 Integrated circuit capacitor 14 2000
* 7,489,519 Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA 1 2008
 
UTAC HONG KONG LIMITED (2)
* 7,315,080 Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader 28 2004
7,371,610 Process for fabricating an integrated circuit package with reduced mold warping 26 2004
 
ALPINE MICROSYSTEMS, INC. (1)
* 6,175,161 System and method for packaging integrated circuits 53 1998
 
CANON KABUSHIKI KAISHA (1)
* 8,786,071 Wiring pattern having a stub wire 0 2010
 
CTC Corporation (1)
* 6,005,777 Ball grid array capacitor 22 1998
 
FREESCALE SEMICONDUCTOR, INC. (1)
* 8,643,189 Packaged semiconductor die with power rail pads 0 2012
 
FUJITSU LIMITED (1)
* 6,424,032 Semiconductor device having a power supply ring and a ground ring 7 2000
 
GLOBALFOUNDRIES INC. (1)
* 6,551,114 Semiconductor device having signal contacts and high current power contacts 1 2001
 
INFINEON TECHNOLOGIES AG (1)
* 6,774,479 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device 6 2002
 
INVENSAS CORPORATION (1)
* 6,414,386 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings 7 2000
 
KABUSHIKI KAISHA TOSHIBA (1)
* 6,545,348 Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip 8 2000
 
NXP B.V. (1)
* 6,222,260 Integrated circuit device with integral decoupling capacitor 32 1998
 
PTI Powertest Technology, Inc. (1)
* 6,028,349 Re-routing lead frame package and semiconductor memory package using the same 1 1999
 
RENESAS ELECTRONICS CORPORATION (1)
* 7,763,966 Resin molded semiconductor device and differential amplifier circuit 0 2008
 
ROHM CO., LTD. (1)
* 7,095,100 Semiconductor device and method of making the same 12 2001
 
SANDIA CORPORATION (1)
7,826,504 Active terahertz metamaterial devices 4 2009
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
* 7,102,211 Semiconductor device and hybrid integrated circuit device 2 2004
 
SHARP KABUSHIKI KAISHA (1)
* 6,703,695 Semiconductor device and method for producing the same 3 2003
 
STMICROELECTRONICS S.A. (1)
* 6,246,072 Integrated circuit test pad 1 1998
* Cited By Examiner