US Patent No: 5,903,050

Number of patents in Portfolio can not be more than 2000

Semiconductor package having capacitive extension spokes and method for making the same

Stats

ATTORNEY / AGENT: (SPONSORED)
 

Importance

Loading Importance Indicators... loading....

Abstract

Disclosed is a pair of conductive rings and method for making the conductive rings for introducing an integral network of capacitive structures around a semiconductor die of a semiconductor package. The pair of conductive rings include a ground rail ring that is defined around a semiconductor die pad that is configured to receive a semiconductor die. The ground rail ring has a first plurality of extension spokes that extend away from the ground rail ring. The pair of conductive rings further includes a power rail ring that is defined around the semiconductor die pad. The power rail ring has a second plurality of extension spokes that extend away from the power rail ring and toward the ground rail ring.

Loading the Abstract Image... loading....

First Claim

Related Publications

Loading Related Publications... loading....

Patent Owner(s)

Patent OwnerAddressTotal Patents
LSI LOGIC CORPORATIONMILPITAS, CA4131

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Wheling Palo Alto, CA 6 137
Kirkman, Scott L Redwood, CA 3 183
Thurairajaratnam, Aritharan San Jose, CA 31 208

Cited Art

Patent Info (Count) # Cites Year
 
AMKOR ELECTRONICS, INC. (1)
5,672,909 Interdigitated wirebond programmable fixed voltage planes 18 1996
 
ANALOG DEVICES, INC. (1)
5,519,576 Thermally enhanced leadframe 12 1995
 
LSI LOGIC CORPORATION (1)
5,691,568 Wire bondable package design with maxium electrical performance and minimum number of layers 41 1996

Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (79)
7,102,208 Leadframe and semiconductor package with improved solder joint strength 2 2000
6,627,977 Semiconductor package including isolated ring structure 31 2002
6,818,973 Exposed lead QFP package fabricated through the use of a partial saw process 74 2002
6,919,620 Compact flash memory card with clamshell leadframe 1 2002
6,798,047 Pre-molded leadframe 5 2002
6,777,789 Mounting for a package containing a chip 6 2003
6,965,159 Reinforced lead-frame assembly for interconnecting circuits within a circuit module 4 2003
6,750,545 Semiconductor package capable of die stacking 13 2003
6,927,483 Semiconductor package exhibiting efficient lead placement 23 2003
6,794,740 Leadframe package for semiconductor devices 4 2003
7,095,103 Leadframe based memory card 0 2003
6,879,034 Semiconductor package including low temperature co-fired ceramic substrate 4 2003
7,045,396 Stackable semiconductor package and method for manufacturing same 77 2003
7,008,825 Leadframe strip having enhanced testability 24 2003
6,876,068 Semiconductor package with increased number of input and output pins 44 2003
7,183,630 Lead frame with plated end leads 7 2003
6,897,550 Fully-molded leadframe stand-off feature 3 2003
7,485,952 Drop resistant bumpers for fully molded memory cards 0 2003
6,873,041 Power semiconductor package with strap 16 2003
7,071,541 Plastic integrated circuit package and method and leadframe for making the package 1 2003
7,245,007 Exposed lead interposer leadframe package 44 2003
7,057,280 Leadframe having lead locks to secure leads to encapsulant 4 2003
6,921,967 Reinforced die pad support structure 4 2003
6,998,702 Front edge chamfer feature for fully-molded memory cards 7 2003
6,846,704 Semiconductor package and method for manufacturing the same 10 2003
6,967,395 Mounting for a package containing a chip 12 2003
6,893,900 Method of making an integrated circuit package 1 2003
7,138,707 Semiconductor package including leads and conductive posts for providing increased functionality 5 2003
7,211,879 Semiconductor package with chamfered corners and method of manufacturing the same 4 2003
6,965,157 Semiconductor package with exposed die pad and body-locking leadframe 9 2003
7,115,445 Semiconductor package having reduced thickness 1 2004
7,057,268 Cavity case with clip/plug for use on multi-media card 3 2004
7,091,594 Leadframe type semiconductor package having reduced inductance and its manufacturing method 7 2004
7,170,150 Lead frame for semiconductor package 2 2004
6,844,615 Leadframe package for semiconductor devices 7 2004
7,005,326 Method of making an integrated circuit package 5 2004
7,190,062 Embedded leadframe semiconductor package 24 2004
7,067,908 Semiconductor package having improved adhesiveness and ground bonding 4 2004
7,211,471 Exposed lead QFP package fabricated through the use of a partial saw process 43 2004
7,202,554 Semiconductor package and its manufacturing method 14 2004
7,045,882 Semiconductor package including flip chip 7 2004
6,953,988 Semiconductor package 18 2004
7,217,991 Fan-in leadframe semiconductor package 8 2004
7,253,503 Integrated circuit device packages and substrates for making the packages 41 2004
7,001,799 Method of making a leadframe for semiconductor devices 2 2004
7,064,009 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 7 2004
7,030,474 Plastic integrated circuit package and method and leadframe for making the package 2 2004
7,176,062 Lead-frame method and assembly for interconnecting circuits within a circuit module 0 2005
7,214,326 Increased capacity leadframe and semiconductor package using the same 4 2005
7,247,523 Two-sided wafer escape package 15 2005
6,995,459 Semiconductor package with increased number of input and output pins 49 2005
7,192,807 Wafer level package and fabrication method 17 2005
7,045,883 Thermally enhanced chip scale lead on chip semiconductor package and method of making same 5 2005
7,507,603 Etch singulated semiconductor package 8 2005
7,361,533 Stacked embedded leadframe 20 2005
7,572,681 Embedded electronic component package 19 2005
7,112,474 Method of making an integrated circuit package 1 2005
7,564,122 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant 1 2006
8,410,585 Leadframe and semiconductor package made using the leadframe 0 2006
7,535,085 Semiconductor package having improved adhesiveness and ground bonding 2 2006
7,902,660 Substrate for semiconductor device and manufacturing method thereof 15 2006
7,968,998 Side leaded, bottom exposed pad and bottom exposed lead fusion quad flat semiconductor package 2 2006
7,321,162 Semiconductor package having reduced thickness 0 2006
7,332,375 Method of making an integrated circuit package 0 2006
7,521,294 Lead frame for semiconductor package 5 2006
7,714,431 Electronic component package comprising fan-out and fan-in traces 20 2006
7,420,272 Two-sided wafer escape package 16 2007
7,723,210 Direct-write wafer level chip scale package 6 2007
7,692,286 Two-sided fan-out wafer escape package 20 2008
7,875,963 Semiconductor device including leadframe having power bars and increased I/O 3 2008
7,977,163 Embedded electronic component package fabrication method 2 2009
8,188,584 Direct-write wafer level chip scale package 0 2010
7,932,595 Electronic component package comprising fan-out traces 4 2010
8,324,511 Through via nub reveal method and structure 0 2010
8,294,276 Semiconductor device and fabricating method thereof 0 2010
8,440,554 Through via connected backside embedded circuit features structure and method 0 2010
8,390,130 Through via recessed reveal structure and method 0 2011
8,119,455 Wafer level package fabrication method 1 2011
8,298,866 Wafer level package and fabrication method 0 2012
 
MICRON TECHNOLOGY, INC. (8)
6,144,089 Inner-digitized bond fingers on bus bars of semiconductor device package 6 1997
6,249,047 Ball array layout 58 1999
6,376,282 Inner-digitized bond fingers on bus bars of semiconductor device package 3 2000
6,423,624 Ball array layout 1 2000
6,548,757 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies 36 2000
6,448,640 Ball array layout in chip assembly 15 2001
6,630,732 Lead frames including inner-digitized bond fingers on bus bars and semiconductor device package including same 1 2002
6,784,367 Microelectronic device assemblies having a shielded input and methods for manufacturing and operating such microelectronic device assemblies 0 2003
 
ROUND ROCK RESEARCH, LLC (6)
6,542,720 Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices 24 1999
6,718,163 Methods of operating microelectronic devices, and methods of providing microelectronic devices 13 2003
7,107,019 Methods of operating microelectronic devices, and methods of providing microelectronic devices 6 2004
7,593,708 Methods of operating electronic devices, and methods of providing electronic devices 4 2006
7,778,621 Methods of operating electronic devices, and methods of providing electronic devices 2 2007
8,036,629 Methods of operating electronic devices, and methods of providing electronic devices 0 2010
 
INTEL CORPORATION (4)
6,222,246 Flip-chip having an on-chip decoupling capacitor 43 1999
6,707,145 Efficient multiple power and ground distribution of SMT IC packages 5 2000
6,920,051 Hybrid capacitor, circuit, and system 22 2002
6,822,526 Voltage plane with high impedance link 2 2002
 
ADVANCED SEMICONDUCTOR ENGINEERING, INC. (3)
6,429,536 Semiconductor device 21 2000
6,448,639 Substrate having specific pad distribution 25 2000
6,833,611 Semiconductor device 1 2003
 
CTS CORPORATION (3)
6,326,677 Ball grid array resistor network 17 1998
7,180,186 Ball grid array package 0 2003
6,946,733 Ball grid array package having testing capability after mounting 3 2003
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (2)
6,437,385 Integrated circuit capacitor 12 2000
7,489,519 Power and ground ring snake pattern to prevent delamination between the gold plated ring and mold resin for wirebond PBGA 0 2008
 
UTAC HONG KONG LIMITED (2)
7,315,080 Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader 17 2004
7,371,610 Process for fabricating an integrated circuit package with reduced mold warping 16 2004
 
ALPINE MICROSYSTEMS, INC. (1)
6,175,161 System and method for packaging integrated circuits 41 1998
 
CTC CORPORATION (1)
6,005,777 Ball grid array capacitor 21 1998
 
FUJITSU LIMITED (1)
6,424,032 Semiconductor device having a power supply ring and a ground ring 7 2000
 
GLOBALFOUNDRIES INC. (1)
6,551,114 Semiconductor device having signal contacts and high current power contacts 1 2001
 
INFINEON TECHNOLOGIES AG (1)
6,774,479 Electronic device having a semiconductor chip on a semiconductor chip connection plate and a method for producing the electronic device 2 2002
 
INVENSAS CORPORATION (1)
6,414,386 Method to reduce number of wire-bond loop heights versus the total quantity of power and signal rings 7 2000
 
KABUSHIKI KAISHA TOSHIBA (1)
6,545,348 Package for a semiconductor device comprising a plurality of interconnection patterns around a semiconductor chip 8 2000
 
NXP B.V. (1)
6,222,260 Integrated circuit device with integral decoupling capacitor 28 1998
 
PTI POWERTEST TECHNOLOGY, INC. (1)
6,028,349 Re-routing lead frame package and semiconductor memory package using the same 1 1999
 
RENESAS ELECTRONICS CORPORATION (1)
7,763,966 Resin molded semiconductor device and differential amplifier circuit 0 2008
 
ROHM CO., LTD. (1)
7,095,100 Semiconductor device and method of making the same 9 2001
 
SANDIA CORPORATION (1)
7,826,504 Active terahertz metamaterial devices 2 2009
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (1)
7,102,211 Semiconductor device and hybrid integrated circuit device 1 2004
 
SHARP KABUSHIKI KAISHA (1)
6,703,695 Semiconductor device and method for producing the same 2 2003
 
STMICROELECTRONICS S.A. (1)
6,246,072 Integrated circuit test pad 0 1998