Conductive polymer film bonding technique
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United States of America Patent
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May 11, 1999
Grant Date -
N/A
app pub date -
Apr 21, 1997
filing date -
Apr 21, 1997
priority date (Note) -
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Abstract
The specification describes a thermocompression bonding process using anisotropic conductive film (ACF) bonding material in which the bonding pads are shaped to prevent depletion of conductive particles in the bonding region during compression. The process is useful in bump technology for interconnecting component assemblies on substrates such as glass, printed wiring boards, etc. The shaped structure can be made using photodefinable polymer strips around the bonding pads where the strips are thicker than the bonding pad. Alternative approaches to shaping one or both of the mating conductive surfaces are disclosed.
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