Universal wafer carrier for wafer level die burn-in
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United States of America Patent
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May 18, 1999
Issued Date -
N/A
app pub date -
May 6, 1996
filing date -
Aug 29, 1990
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
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