Programmable/reprogrammable structure using fuses and antifuses
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United States of America Patent
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May 25, 1999
Issued Date -
N/A
app pub date -
Jun 30, 1997
filing date -
Jan 18, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In one embodiment, the steps for forming an electrical conductor between conductive layers of a printed circuit board include the following steps: (1) applying a first dielectric material on a first conductive layer; (2) forming a number of via holes at each of the predetermined locations in the first dielectric material at which an electrical conductor is to be formed; (3) selectively applying a second dielectric material to at least fill each of the via holes, to form a composite dielectric layer; (4) applying a second conductive layer on the composite dielectric layer; (5) etching the first conductive layer to form a first electrode; (6) etching the second conductive layer to form a second electrode; and (7) applying a programming voltage across the second dielectric material in each of the via holes to form an electrical conductor in each of the via holes, each electrical conductor connecting an electrode in the first conductive layer to an electrode in the second conductive layer.
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