PDC cutter element having improved substrate configuration
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United States of America Patent
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May 25, 1999
Issued Date -
N/A
app pub date -
Sep 4, 1996
filing date -
Jun 13, 1996
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A supporting substrate for supporting a diamond layer on a cutting element is disclosed which has an irregular surface defining the interface between the substrate and the diamond layer. The irregularities in the surface comprise closed loops that may vary in amplitude, frequency or both. The irregularities may comprise ridges or grooves or a combination of ridges and grooves.
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