Lid assembly for semiconductor processing chamber
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United States of America Patent
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May 25, 1999
Grant Date -
N/A
app pub date -
Apr 16, 1996
filing date -
Apr 16, 1996
priority date (Note) -
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Abstract
A method and apparatus for controlling the temperature, maintaining the vacuum integrity and facilitating maintenance of a lid assembly (2) in a wafer processing apparatus. The apparatus comprises a gas distribution plate (42) defining one or more gas distribution holes (50) formed therethrough for passage of process gas(es), and a base plate (10) thermally coupled to the gas distribution plate. The base plate (10) has a gas inlet in communication with the gas distribution holes, a fluid inlet (98) for receiving a coolant fluid and a fluid outlet (102) for discharging the coolant fluid. A fluid passage (94) is formed through portions of the base plate in communication with the fluid inlet and outlet to allow a coolant fluid to flow therethrough and to transfer heat from the gas injection and distribution plates. The base plate is an integral, single piece that minimizes the use of gas seals in the lid assembly and facilitates disassembly and assembly of the lid assembly for cleaning and other maintenance.
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