Importance

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Abstract

A method for forming a plurality of holes, creating profiles, in a plurality of vinyl layers using a hollow portion of an RF sealing die and for removing the profiles from the die using a base plate punch and a removal means. The method includes providing a base plate support having a first hole for receiving the punch and a support surface, stacking the layers into a stack on the surface over the first hole where there is provided under the stack a layer of dielectric material having a receiving hole symmetrically aligned with the first hole, pressing the die through each of the layers of the stack to form the profiles received within the hollow portion of the die and to seal together portions of the layers of vinyl material which surround the outer surface of the die, sliding the punch through the first receiving holes and into the hollow portion of the die to push the profiles further into the die where the diameter of the receiving hole is substantially the same as the diameter of the punch to minimize the area between the punch and the dielectric material as the punch passes through the receiving hole and into the contact with the profiles to prevent arcing of the profiles during movement of the profiles through the die, and removing the profiles from the die using a removal means connected to the die.

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First Claim