Cleaning and stripping of photoresist from surfaces of semiconductor wafers

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United States of America Patent

PATENT NO 5908319
SERIAL NO

08637137

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Abstract

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In a microwave downstream process, a microwave plasma is formed from a gas that has a small quantity of fluorine to enhance ashing without substantial oxide loss. This process can be performed before or after other microwave downstream processes or reactive ion etching processes.

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Patent Owner(s)

Patent OwnerAddress
ULVAC JAPAN LTD2500 HAGISONO CHIGASAKI-SHI KANAGAWA-KEN 253

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bersin, Richard L Lawrence, MA 10 459
Xu, Han Lexington, MA 94 1226

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