Method of electroplating non-conductive materials
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United States of America Patent
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Jun 1, 1999
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app pub date -
Dec 9, 1997
filing date -
Feb 3, 1997
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Abstract
This invention provides a method of electroplating a non-conductive material, the method comprising the steps of bringing a non-conductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound and a copper compound, bringing the material into contact with an aqueous alkaline solution, and electroplating the material. According to the method of the invention, a desired coating having an excellent decorative appearance can be formed by electroplating without involving electroless plating on even a non-conductive material having a large area such as plastic molded components.
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