Apparatus and method for selective area deposition of thin films on electrically biased substrates
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United States of America Patent
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Jun 8, 1999
Issued Date -
N/A
app pub date -
Aug 5, 1994
filing date -
Nov 9, 1992
priority date (Note) -
Expired
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Abstract
An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repells the ionized particles.
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