Method of sequential laser processing to efficiently manufacture modules requiring large volumetric density material removal for micro-via formation
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United States of America Patent
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Jun 8, 1999
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app pub date -
Nov 8, 1996
filing date -
Nov 8, 1996
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Abstract
A method for forming a blind-via in a laminated substrate by laser drilling a blind-via from a top surface of the substrate toward a bottom surface of the substrate using a first laser and a first trepanning motion of a laser focal spot of the first laser. Then, the via is laser drilled from the top surface toward the bottom surface using a second laser and a second trepanning motion of a laser focal spot of the second laser.
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