Laminate circuit board with selectable connections between wiring layers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5910755
SERIAL NO

08959711

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Abstract

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A laminate capacitor circuit board which permits constants of various kinds of circuit elements to be set by selectively effected connections between wiring layers, and a laminate capacitor circuit board which permits distributed circuit constants in a high-frequency wiring layer sandwiched between two shielding wiring layers to be set as desired. These circuits are formed with at least a pattern of a conductive foil on each dielectric layer, and include a plurality of wiring layers laminated one upon another, a wiring layer for connections laminated to a surface of the plurality of wiring layers laminated one upon another, a plurality of terminal patterns formed on the wiring layer for connections in a state insulated from each other, a plurality of vias for electrically connecting at least two of the plurality of terminal patterns to corresponding ones of the plurality of wiring layers, and connecting means for selectively connecting the plurality of terminal patterns to each other.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU LIMITEDKANAGAWA 211-8588

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Mitsunori Kawasaki, JP 19 96
Mishiro, Hidehiro Kawasaki, JP 3 84
Takada, Rie Kawasaki, JP 24 211
Tsubone, Kenichiro Kawasaki, JP 8 87

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