Method and device for mechanically removing solder beads on the surface of the printed circuit boards
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United States of America Patent
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-
Jun 15, 1999
Grant Date -
N/A
app pub date -
Jul 25, 1997
filing date -
Aug 10, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.
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