Method of producing semiconductor device and rinse for cleaning semiconductor device
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United States of America Patent
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Jun 15, 1999
Grant Date -
N/A
app pub date -
Jan 9, 1997
filing date -
Feb 5, 1996
priority date (Note) -
Expired
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Abstract
A method of producing a semiconductor device, which includes applying a conductive metal film on a semiconductor wafer, applying a photoresist on the conductive metal film, removing the photoresist with a removing agent containing a fluorine compound or at least one basic component selected from the group consisting of a quaternary ammonium hydroxide, an alkanolamine and a mixture of an alkanolamine and a reducing agent, and cleaning the resultant semiconductor device by rinsing with a rinse comprising water and at least one peroxide compound. The method of the present invention can provide a highly accurate wiring circuit without corrosion of the conductive metal film.
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