Resin forming method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5911931
SERIAL NO

08950066

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Abstract

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A method for forming a resin including the steps of forming a resin by using a resin forming nozzle device while supplying thereto a surface lubricant for mold release, having a viscosity of 0.1 to 1,000 cP during use and a surface tension of 40 dyn/cm or less at a temperature of 25.degree. C., wherein the resin forming nozzle device includes the surface lubricant being continuously introduced to a nozzle face having the discharge openings of resin extrusion orifices, the device further including a feed section for supplying a surface lubricant from the outside, and one or more grooves formed on said nozzle face in positions adjacent to the discharge openings of the nozzle face so that the grooves have a width of 10 to 3,000 .mu.m and a depth of 10 .mu.m or greater and at least one end thereof communicates with the surface lubricant feed section.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI RAYON CO LTDTOKYO 108-8506

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukuda, Zenpei Otake, JP 2 2
Okamoto, Masashi Otake, JP 107 647

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