Method for forming thin film capacitors

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 5912044
SERIAL NO

08782205

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Thin film capacitors are formed by a multi-level dry processing method that includes simultaneous ablation of via openings through both the dielectric and the metal electrode layers of a capacitor. Preferably, the dielectric films are formed of barium strontium titanate and the metal electrode layers are formed of platinum. The present invention overcomes the problems associated with the use of strong etchants to sequentially form separate via openings through the electrode and dielectric layers, prevents the potential for delamination of the respective layers during wet etching and the possible undesirable effects of etching solutions on substrate materials.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
INTERNATIONAL BUSINESS MACHINES CORPORATIONARMONK, NY46918

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Farooq, Mukta Shaji Hopewell Junction, NY 7 116
Giri, Ajay P Poughkeepsie, NY 20 315
Patel, Rajesh Shankerial Fremont, CA 1 29

Cited Art Landscape

Patent Info (Count) # Cites Year
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
* 5027253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards 124 1990
 
RPX CORPORATION (1)
* 5527729 Method of manufacturing a capacitor having metal electrodes 24 1995
 
RENESAS ELECTRONICS CORPORATION (1)
* 5406447 Capacitor used in an integrated circuit and comprising opposing electrodes having barrier metal films in contact with a dielectric film 90 1992
 
LOCKHEED MARTIN CORPORATION (1)
* 5653841 Fabrication of compact magnetic circulator components in microwave packages using high density interconnections 19 1995
 
FUJITSU LIMITED (2)
* 5323520 Process for fabricating a substrate with thin film capacitor 17 1993
* 5406446 Thin film capacitor 11 1994
 
INVENSAS CORPORATION (1)
* 5756395 Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures 63 1995
 
ANALOG DEVICES, INC. (1)
* 5479316 Integrated circuit metal-oxide-metal capacitor and method of making same 101 1993
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
* 5459635 Laminated thin film capacitor and method for producing the same 25 1994
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
* 2007/0271,752 Passive device structure 0 2007
* 2008/0106,848 iTFC WITH OPTIMIZED C(T) 0 2008
* 2008/0263,842 THIN FILM CAPACITORS AND METHODS OF MAKING THE SAME 0 2008
 
LUCENT TECHNOLOGIES INC. (1)
* 6320244 Integrated circuit device having dual damascene capacitor 74 1999
 
MICRON TECHNOLOGY, INC. (1)
* 6833285 Method of making a chip packaging device having an interposer 69 2000
 
BLACKBERRY LIMITED (4)
* 8569142 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same 0 2007
* 2007/0209,201 MULTI-LEVEL THIN FILM CAPACITOR ON A CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 1 2007
8883606 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same 0 2013
9305709 Method of forming a multi-level thin film capacitor 0 2014
 
CHEMTRON RESEARCH LLC (1)
* 7256980 Thin film capacitors on ceramic 0 2004
 
FUJITSU LIMITED (2)
* 9082552 Method of manufacturing capacitor 0 2012
* 2013/0038,981 CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR 2 2012
 
NXP USA, INC. (2)
6500724 Method of making semiconductor device having passive elements including forming capacitor electrode and resistor from same layer of material 54 2000
6825092 Semiconductor device having passive elements and method of making same 20 2002
 
SHINKO ELECTRIC INDUSTRIES CO., LTD. (1)
* 6754952 Process for manufacturing multiple layer wiring substrate onto which thin film capacitor is incorporated 10 2002
 
TEXAS TREASURY SAFEKEEPING TRUST COMPANY (2)
* 8256078 Method of forming long strips of dielectric coated metalized film 0 2010
* 2012/0002,347 Method of Forming Long Strips of Dielectric Coated Metalized Film 0 2010
 
WSOU INVESTMENTS, LLC (1)
* 6566269 Removal of post etch residuals on wafer surface 7 2000
 
INTEL CORPORATION (15)
* 2006/0000,542 METAL OXIDE CERAMIC THIN FILM ON BASE METAL ELECTRODE 11 2004
* 2006/0099,803 Thin film capacitor 15 2004
* 2006/0091,495 Ceramic thin film on base metal electrode 9 2004
7629269 High-k thin film grain size control 3 2005
7375412 iTFC with optimized C(T) 4 2005
* 2006/0220,176 High-k thin film grain size control 1 2005
* 2006/0220,177 Reduced porosity high-k thin film mixed grains for thin film capacitor applications 0 2005
7453144 Thin film capacitors and methods of making the same 2 2005
* 2007/0001,259 Thin film capacitors and methods of making the same 0 2005
7733626 Passive device structure 1 2007
7547957 Thin film capacitors and methods of making the same 2 2007
7755165 iTFC with optimized C(T) 1 2008
7656644 iTFC with optimized C(T) 0 2008
8499426 Methods of making thin film capacitors 0 2008
* 2009/0316,374 Reduced Porosity High-K Thin Film Mixed Grains for Thin Film Capacitor Applications 1 2009
 
Ultrasource, Inc. (9)
6761963 Integrated thin film capacitor/inductor/interconnect system and method 21 2001
6998696 Integrated thin film capacitor/inductor/interconnect system and method 8 2003
6890629 Integrated thin film capacitor/inductor/interconnect system and method 10 2003
7327582 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2005/0175,938 Integrated thin film capacitor/inductor/interconnect system and method 3 2005
7425877 Lange coupler system and method 1 2005
* 2005/0162,236 Lange coupler system and method 2 2005
7446388 Integrated thin film capacitor/inductor/interconnect system and method 6 2005
* 2006/0097,344 Integrated thin film capacitor/inductor/interconnect system and method 0 2005
 
MICROCOATING TECHNOLOGIES, INC. (1)
* 6270835 Formation of this film capacitors 67 1999
 
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (1)
* 6379977 Method of manufacturing ferroelectric memory device 4 1999
 
TOKYO ELECTRON LIMITED (1)
8247289 Capacitor and manufacturing method thereof 0 2006
* Cited By Examiner