Method and apparatus for in-line solder paste inspection
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United States of America Patent
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Jun 15, 1999
Issued Date -
N/A
app pub date -
Dec 19, 1996
filing date -
Dec 19, 1996
priority date (Note) -
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status (Latency Note)
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Abstract
Inspection of solder paste on a printed circuit board using a before printing image (pre-image) to normalize an after printing image (post-image) of the printed circuit board. Existing lighting and optics used for alignment of the screen printing stencil to the printed circuit board are used for the solder paste inspection. A stencil in the screen printing process is also inspected using a before printing image (pre) to normalize an after printing image (post) of the stencil.
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