Injection molded, heat-sealed housing and half-etched lead frame for oximeter sensor
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United States of America Patent
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-
Jun 22, 1999
Grant Date -
N/A
app pub date -
Apr 7, 1997
filing date -
Apr 26, 1996
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention is directed to an oximeter sensor to measure the oxygen content of a patient's blood. The sensor can include a lead frame having different thicknesses, a sensor housing being molded from a common thermoplastic resin, and rib members in the housing for inhibiting shorting between adjacent traces of the lead frame. The present invention further includes a process for forming the sensor.
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