Metallic housing for implant with recesses for eddy current reduction
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United States of America Patent
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-
Jun 22, 1999
Grant Date -
N/A
app pub date -
Oct 23, 1997
filing date -
Oct 23, 1996
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An implant for implanting into human tissue includes a hermetically sealed, metallic housing for enclosing electronic means inside the housing for a high-frequency, telemetric information transfer between a programming device and the implant. The implant additionally includes a head for connecting a stimulation line. The housing comprises a metallic wall including groove-shaped recesses arranged at least on an inside of the metallic wall and which reduce a thickness of the metallic wall so that in a region of the recesses on the housing wall a material thickness does not fall below that which is necessary under operating conditions to ensure that the housing is impermeable to fluids.
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