Two layer hermetic-like coating process for on-wafer encapsulation of GaAs MMIC's
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United States of America Patent
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Jun 22, 1999
Issued Date -
N/A
app pub date -
May 27, 1997
filing date -
Dec 21, 1995
priority date (Note) -
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Abstract
A microwave system encapsulated by two layers. The first layer is an arylcyclobutene polymer having a thickness greater than the tallest component of the system and only located in predetermined areas. Overlaying the polymer and other preselected areas of the system is a ceramic glass material. These two layers are applied in two layers coating process steps.
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