Semiconductor device having a ball grid array package structure using a supporting frame
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United States of America Patent
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Jun 22, 1999
Issued Date -
N/A
app pub date -
Feb 25, 1997
filing date -
Feb 10, 1994
priority date (Note) -
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Abstract
A semiconductor plastic package, more particularly a preferred package structure and method for making a BGA package. A resin sealed BGA package where a supporting frame which fixedly supports semiconductor parts; i.e., an IC chip, a circuit board, or a circuit film, is sealed with resin, using a mold which is composed of an upper mold half and a lower mold half with the lower mold half having a plurality of projections, one at a position corresponding to each of the external terminals. The mold has a divisional structure which has an air vent between the divisional elements thereof.
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